EUV Double Patterning Solution for Subtractive Metal Patterning at 18nm Pitch
- Chris Penny
- Koichi Motoyama
- et al.
- 2024
- SPIE Advanced Lithography + Patterning 2024
Publications
Date
Featured collections
Popular topics
185 results for Hybrid Cloud Infrastructure
Systems Two Phase Cooling
- Timothy Chainer
- Liz Hulihan
- et al.
- 2023
- ARPA-E COOLERCHIPS Kickoff Meeting 2023
SUSTAINABLE COMPUTING – THERMAL CHALLENGES AND OPPORTUNITIES
- Pritish Parida
- 2023
- iTHERM 2023
It’s alive! Image live migration, live import and Instant restore with Ceph RBD
- Danny Harnik
- Effi Ofer
- et al.
- 2023
- CEPHALOCON 2023
How Data Center Networks Can Improve Through Co-packaged Optics
- Pavlos Maniotis
- Laurent Schares
- et al.
- 2023
- OFC 2023
Zero Trust Hardware Architectures: when we “never trust”, what can we do to “always verify?”
- Mengmei Ye
- Sandhya Koteshwara
- 2022
- WISE 2022
Attestation of System Components
- 2020
- OCP Global Summit 2020
Digitalization concepts to optimize O&M strategies in Offshore Wind Energy
- Michael Nidd
- Moritz Gräfe
- et al.
- 2019
- WindEurope Offshore 2019
Composable Systems in Kubernetes
- 2024
- KubeCon EU 2024
The >5GHz next generation IBM Z processor chip
- Christian Jacobi
- 2021
- Hot Chips 33