Short Time Annealing of Coevaporated Tungsten Silicide Films
- T.O. Sedgwick
- F.M. d'Heurle
- et al.
- 2019
- JES
Publications
509 results at JES
Equilibrium Carrier Density and Solubility of Antimony in Silicon
- D. Nobili
- R. Angelucci
- et al.
- 2019
- JES
Feature-Size Dependence of Etch Rate in Reactive Ion Etching
- Young H. Lee
- Zhen H. Zhou
- 2019
- JES
Combined Experimental and Modeling Study of Spatial Effects in Plasma Etching: CF4/O2 Etching of Silicon
- M. Dalvie
- K.F. Jensen
- 2019
- JES
Fundamental Study of Acid Copper Through-Hole Electroplating Process
- Edward K. Yung
- Lubomyr T. Romankiw
- 2019
- JES
A new process using two photo-masks to prepare trilayer thin film transistors
- Yue Kuo
- 2019
- JES
Composition Determination of Electrodeposited NiSn and PbSn Alloys Using Stripping Voltammetry at a Rotating Ring-Disk Electrode
- K.H. Wong
- P.C. Andricacos
- 2019
- JES
Plating of Copper into Through-Holes and Vias
- Richard C. Alkire
- Lubomyr T. Romankiw
- 2019
- JES
Interaction Between ti and SiO2
- C.-Y. Ting
- M. Wittmer
- et al.
- 2019
- JES
An XPS and TEM Study of Intrinsic Adhesion Between Polyimide and Cr Films
- N.J. Chou
- D.W. Dong
- et al.
- 2019
- JES