Patterned cracks improve yield in the release of compliant microdevices from silicon-on-insulator wafers
- G.C. Hill
- J.I. Padovani
- et al.
- 2011
- JMM
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2 results for B.L. Pruitt
Patterned cracks in the buried oxide layer improve yield in device release from soi wafers
- G.C. Hill
- J.I. Padovani
- et al.
- 2011
- MEMS 2011