Chip-level power-performance optimization through thermally-driven across-chip variation (ACV) reductionX. YuOleg Gluschenkovet al.2011IEDM 2011
High performance 45-nm SOI technology with enhanced strain, porous low-k BEOL, and immersion lithographyS. NarasimhaK. Onishiet al.2006IEDM 2006
Advanced modeling and optimization of high performance 32nm HKMG SOI CMOS for RF/analog SoC applicationsSungjae LeeJ. Johnsonet al.2012VLSI Technology 2012