3D integrated water cooling of a composite multilayer stack of chips
- Fabio Alfieri
- Manish K. Tiwari
- et al.
- 2010
- IHTC 2010
Publications
155 results for Thomas Brunschwiler
3D-ICE: Fast compact transient thermal modeling for 3D ICs with inter-tier liquid cooling
- Arvind Sridhar
- Alessandro Viricenzi
- et al.
- 2010
- ICCAD 2010
Heat-removal performance scaling of interlayer cooled chip stacks
- Thomas Brunschwiler
- Stephan Paredes
- et al.
- 2010
- ITherm 2010
Experimental investigation of an ultrathin manifold microchannel heat sink for liquid-cooled chips
- W. Escher
- Thomas Brunschwiler
- et al.
- 2010
- Journal of Heat Transfer
Self-contained, oscillating flow liquid cooling system for thin form factor high performance electronics
- R. Wälchli
- Thomas Brunschwiler
- et al.
- 2010
- Journal of Heat Transfer
Energy-efficient variable-flow liquid cooling in 3D stacked architectures
- Ayse K. Coskun
- David Atienza
- et al.
- 2010
- DATE 2010
Combined local microchannel-scale CFD modeling and global chip scale network modeling for electronics cooling design
- R. Wälchli
- Thomas Brunschwiler
- et al.
- 2010
- Int. J. Heat Mass Transf.
Antenna coupled far-infrared/THz detector in CMOS
- T. Morf
- Jonas Weiss
- et al.
- 2009
- Electronics Letters
Hotspot-adapted cold plates to maximize system efficiency
- Thomas Brunschwiler
- Hugo Rothuizen
- et al.
- 2009
- THERMINIC 2009
Validation of the porous-medium approach to model interlayer-cooled 3D-chip stacks
- T. Brunschwiler
- S. Paredes
- et al.
- 2009
- 3DIC 2009