Novel Advanced Low-k Dielectric for 2 nm and Beyond Cu and Post Cu Dual Damascene BEOL Interconnect Technologies
- Son Nguyen
- Huai Huang
- et al.
- 2025
- VLSI Technology and Circuits 2025
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5 results for Matthew Shoudy
The Extreme Extendibility of Cu and Post-Cu Dual Damascene BEOL Interconnect Technology
- Daniel Edelstein
- Son Nguyen
- et al.
- 2024
- IEDM 2024
Evaluation of different metal preclean conditions for MOL for 2nm and beyond
- Samuel Swaroop Munnangi
- Andrew Simon
- et al.
- 2024
- ASMC 2024
Optimization of Area Selective Barrier on Different Metal Interconnects
- Linda Wangoh
- Andrew Simon
- et al.
- 2024
- ASMC 2024
Flowable Chemical Vapor Deposition of Lightly Porous Low k SiCOH Dielectrics—Remote Plasma Deposition Processing, Film Analysis and Gap-Fill Application in Nano Device Fabrication
- Son Nguyen
- Thomas Haigh
- et al.
- 2022
- MRS Fall Meeting 2022