Application of cyclic fluorocarbon/argon discharges to device patterning
- Dominik Metzler
- Kishore Uppireddi
- et al.
- 2016
- JVSTA
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93 results for Robert L. Bruce
Challenges of tailoring surface chemistry and plasma/surface interactions to advance atomic layer etching
- Sebastian U. Engelmann
- Robert L. Bruce
- et al.
- 2015
- ECS J. Solid State Sci. Technol.
CMOS-Compatible self-aligned In0.53Ga0.47As MOSFETs with gate lengths down to 30 nm
- Amlan Majumdar
- Yanning Sun
- et al.
- 2014
- IEEE T-ED
Fabrication of sub-20 nm nanopore arrays in membranes with embedded metal electrodes at wafer scales
- Jingwei Bai
- Deqiang Wang
- et al.
- 2014
- Nanoscale
Fluorocarbon assisted atomic layer etching of SiO2 using cyclic Ar/C4F8 plasma
- Dominik Metzler
- Robert L. Bruce
- et al.
- 2013
- JVSTA
Investigation of plasma etch damage to porous oxycarbosilane ultra low-k dielectric
- Robert Bruce
- Sebastian Engelmann
- et al.
- 2013
- Journal of Physics D: Applied Physics
Highly selective silicon nitride etching to Si and SiO2 for a gate sidewall spacer using a CF3I/O2/H2 neutral beam
- Daiki Nakayama
- Akira Wada
- et al.
- 2013
- Journal of Physics D: Applied Physics
Post porosity plasma protection: Scaling of efficiency with porosity
- Theo Frot
- Willi Volksen
- et al.
- 2012
- Advanced Functional Materials
Characterization and mechanism of He plasma pretreatment of nanoscale polymer masks for improved pattern transfer fidelity
- Florian Weilnboeck
- D. Metzler
- et al.
- 2011
- Applied Physics Letters
On the absence of post-plasma etch surface and line edge roughness in vinylpyridine resists
- R. Bruce
- Florian Weilnboeck
- et al.
- 2011
- Journal of Vacuum Science and Technology B:Nanotechnology and Microelectronics