Copper migration and precipitate dissolution in aluminum/copper lines during electromigration testing
- T.M. Shaw
- C.-K. Hu
- et al.
- 1996
- MRS Spring Meeting 1996
Publications
This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.
Date
Featured collections
Popular topics
61 results for Robert Rosenberg
High performance metallization issues for ULSI
- R. Rosenberg
- 1994
- MRS Spring Meeting 1994
Microstructure modulation in copper interconnects
- Chih-Chao Yang
- Baozhen Li
- et al.
- 2014
- IEEE Electron Device Letters
Effects of metal capping on thermal annealing of copper interconnects
- Chih-Chao Yang
- B. Li
- et al.
- 2012
- IEEE Electron Device Letters
Low-temperature reflow anneals of Cu on Ru
- C.-C. Yang
- Fenton R. McFeely
- et al.
- 2011
- IEEE Electron Device Letters
Enhanced electromigration resistance through grain size modulation in copper interconnects
- C. C. Yang
- Baozhen Li
- et al.
- 2015
- CSTIC 2015
Thermal stress control in Cu interconnects
- Chih-Chao Yang
- Baozhen Li
- et al.
- 2014
- IITC/AMC 2014
Microstructure, impurity and metal cap effects on Cu electromigration
- C. K. Hu
- Lynne Gignac
- et al.
- 2012
- AIP-CP 2012
Effect of impurity on Cu electromigration
- C.-K. Hu
- Matthew Angyal
- et al.
- 2010
- International Workshop STRESS-INDUCED PHENOMENA IN METALLIZATION 2010
Electromigration Cu mass flow in Cu interconnections
- C.-K. Hu
- D. Canaperi
- et al.
- 2006
- Thin Solid Films