Scalable Advanced DBHi Chiplet Package Using Silicon Bridge With 30 μm-Pitch Solder Joints
- Akihiro Horibe
- Takahito Watanabe
- et al.
- 2024
- ECTC 2024
Publications
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10 results for Qianwen Chen
Next Generation Infrared (IR) Laser Debonding / Silicon Handle Technology for Precision Chiplet Technology Applications
- Qianwen Chen
- Michael Belyansky
- et al.
- 2023
- ECTC 2023
Panel Packaging Approach to Micro Thin-film Battery Sealing for Healthcare and Internet of Things (IoT) Applications
- Qianwen Chen
- Bing Dang
- et al.
- 2020
- ECTC 2020
Novel packaging structure and processes for micro-TFB (thin film battery) to enable miniaturized healthcare internet-of-things (IoT) devices
- Bing Dang
- Qianwen Chen
- et al.
- 2019
- ECTC 2019
High-speed precision handling technology of micro-chip for fan-out wafer level packaging (FOWLP) application
- Qianwen Chen
- Li-Wen Hung
- et al.
- 2018
- ECTC 2018
Column Interconnects: A Path Forward for Embedded Cooling of High Power 3D Chip Stacks
- Mark D. Schultz
- Cyril Cabral
- et al.
- 2018
- ECTC 2018
Heterogeneous integration technology demonstrations for future healthcare, IoT, and AI computing solutions
- John Knickerbocker
- Russell A. Budd
- et al.
- 2018
- ECTC 2018
Integration and Packaging of Embedded Radial Micro-Channels for 3D Chip Cooling
- Bing Dang
- Evan Colgan
- et al.
- 2016
- ECTC 2016
Feasibility Study of Si Handler Debonding by Laser Release
- Bing Dang
- Thomas Wassick
- et al.
- 2016
- ECTC 2016
Assembly and packaging of non-bumped 3D chip stacks on bumped substrates
- Bing Dang
- Joana Maria
- et al.
- 2014
- ECTC 2014