Panel Packaging Approach to Micro Thin-film Battery Sealing for Healthcare and Internet of Things (IoT) Applications

Abstract

In this work, a panel packaging approach based on programmable laser milling, injection molded soldering (IMS), and temporary handling technologies has been proposed and demonstrated for micro thin-film-battery (TFB) cells. Micro TFB cells in the dimensions of 2.5mm × 2.5mm × 0.1mm have been successfully packaged and sealed with overmolding solder.