Fully subtractive Ru Topvia interconnects with minimum 9 nm-space airgap for RC performance and reliability enhancement as post-Cu interconnects
- Koichi Motoyama
- Jaemyung Choi
- et al.
- 2024
- IEDM 2024
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Evaluation of different metal preclean conditions for MOL for 2nm and beyond
- Samuel Swaroop Munnangi
- Andrew Simon
- et al.
- 2024
- ASMC 2024