Integrated dual SPE processes with low contact resistivity for future CMOS technologiesHeng WuSoon-Cheon Seoet al.2017IEDM 2017
A 7nm FinFET technology featuring EUV patterning and dual strained high mobility channelsRuilong XiePietro Montaniniet al.2016IEDM 2016
E-beam inspection of EUV mask defects: To etch or not to etch?Ravi BonamHung-Yu Tienet al.2014SPIE Advanced Lithography 2014