Unibody plastic injection-molded optical sub-assembly for large core fiber
- J.M. Trewhella
- M.M. Oprysko
- et al.
- 1996
- ECTC 1996
Publications
8 results for M.F. Cina
Improvements in Index Alignment Method for Laser-Fiber Array Packaging
- M.S. Cohen
- M.J. DeFranza
- et al.
- 1994
- IEEE Transactions on Components Packaging and Manufacturing Technology Part B
A High-Density, Four-Channel, OEIC Transceiver Module Utilizing Planar-Processed Optical Waveguides and Flip-Chip, Solder-Bump Technology
- K. Jackson
- E.B. Flint
- et al.
- 1994
- Journal of Lightwave Technology
Improvements in Index alignment method for laser-fiber array packaging
- M.S. Cohen
- M.J. DeFranza
- et al.
- 1993
- ECTC 1993
Flip-chip, self-aligned, optoelectronic transceiver module
- K. Jackson
- E.B. Flint
- et al.
- 1992
- IEE/LEOS Summer Topical Meetings 1992
Packaging of High-Density Fiber/Laser Modules Using Passive Alignment Techniques
- Mitchell S. Cohen
- Michael F. Cina
- et al.
- 1992
- IEEE Transactions on Components, Hybrids, and Manufacturing Technology
Passive Laser-Fiber Alignment by Index Method
- M.S. Cohen
- M.F. Cina
- et al.
- 1991
- IEEE Photonics Technology Letters
Optical fiber coupling approaches for multi-channel laser and detector arrays
- K. Jackson
- A.J. Moll
- et al.
- 1989
- Proceedings of SPIE 1989