Publications

18 results for Mark A. Jaso

Sub-μm, planarized, Nb-AlO_x-Nb Josephson process for 125 mm wafers developed in partnership with Si technology
- - M.B. Ketchen
  - D.J. Pearson
  - et al.
- 1991
- Applied Physics Letters
A novel application of polyimide-W-AI/CU for VLSI interconnect
- - R.V. Joshi
  - L. Hsu
  - et al.
- 1991
- VMIC 1991
A 0.5 μm fully scaled two-level metal fully planarized interconnect structure fabricated with X-ray lithography
- - D. Moy
  - L.K. Wang
  - et al.
- 1990
- VLSI Technology 1990
A photoemission investigation of surface processes affecting the reactive ion etching of TiSi₂ in CF₄
- - S.W. Robey
  - M.A. Jaso
  - et al.
- 1989
- Journal of Applied Physics
Low-resistance submicron CVD W interlevel via plugs on Al-Cu-Si
- - R.V. Joshi
  - S.B. Brodsky
  - et al.
- 1989
- VMIC 1989
Surface analysis of realistic semiconductor microstructures
- - Gottlieb S. Oehrlein
  - Kevin K. Chan
  - et al.
- 1989
- Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
In situ spatially resolved surface characterization of realistic semiconductor structure after reactive ion etching process
- - Gottlieb S. Oehrlein
  - Kevin K. Chan
  - et al.
- 1988
- Journal of Applied Physics
Transient fluorocarbon film thickness effects near the silicon dioxide/silicon interface in selective silicon dioxide reactive ion etching
- - Mark A. Jaso
  - Gottlieb S. Oehrlein
- 1988
- Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films