M.F. Cowlishaw
IBM Systems Journal
An overview of wafer-level three-dimensional (3D) integration technology is provided. The basic reasoning for pursuing 3D integration is presented, followed by a description of the possible process variations and integration schemes, as well as the process technology elements needed to implement 3D integrated circuits. Detailed descriptions of two wafer-level integration schemes implemented at IBM are given, and the challenges of bringing 3D integration into a production environment are discussed. © Copyright 2008 by International Business Machines Corporation.
M.F. Cowlishaw
IBM Systems Journal
Hendrik F. Hamann
InterPACK 2013
Beomseok Nam, Henrique Andrade, et al.
ACM/IEEE SC 2006
Robert E. Donovan
INTERSPEECH - Eurospeech 2001