Vapor Phase Deposition of Palladium for Electroless Copper Plating

Abstract

The organometallic compound allylcyclopentadienylpalladium can be easily prepared in high yield. The compound exhibits unusual volatility at room temperature. Photochemical decomposition of allylcyclopentadienylpalladium results in the deposition of film that consists of a homogeneous mixture of palladium particles in an organic matrix. Without further activation, the deposited film is an active catalyst for electroless copper plating. The plated copper was uniform and conformal and exhibited good electrical properties. © 1989, The Electrochemical Society, Inc. All rights reserved.