Thermal Design & Performance of 300 mm Wafer Scale System

Abstract

The thermal design and performance of the system packaging for a 300 mm wafer scale system is described. The system, which was water cooled, had a total thermal maximum design power of approximately 27 kW. The cooling system consisted of a silicon microchannel cooler, upper and lower cold plates, and (90) heat spreaders. The system packaging had a layered structure with laminates and power conversion components attached to the wafer mounted to the microchannel cooler, a lower layer consisting of pluggable vertical I/O cards and a large I/O planar board above which was an upper layer of pluggable high-voltage vertical cards and a large high-voltage planar. Additionally, eight external I/O cards, which plugged onto the I/O planar board, provided optical links to and from the system.