R.P. Pezzi, M. Copel, et al.
Applied Physics Letters
The x-ray diffraction, medium energy ion scattering and transmission electron microscopy were used to study the microstructure, conformality, roughness and thermal stability of TaN thin films. The synchrotron x-ray diffraction, optical scattering and sheet resistance measurements during thermal annealing of the test structures were used to study the Cu diffusion barrier properties of plasma-enhanced atomic layer deposition (PE-ALD). It was found that the film microstructure is critical to the diffusion barrier performance. It was also found that grain boundary diffusion is dominating for polycrystalline diffusion barrier failure.
R.P. Pezzi, M. Copel, et al.
Applied Physics Letters
J.M.E. Harper, C. Cabral Jr., et al.
Annual Review of Materials Science
F.-J. Meyer Zu Heringdorf, D. Kähler, et al.
Surface Review and Letters
R.M. Feenstra, M.A. Lutz, et al.
MRS Fall Meeting 1994