Joy Y. Cheng, Daniel P. Sanders, et al.
SPIE Advanced Lithography 2008
The microstructure and kinetics of the polymorphic C49 to C54-TiSi2 phase transformation have been studied using samples prepared as in self-aligned silicide applications. For C49-TiSi2 thin films formed at temperatures of 600 and 625°C on (100) single-crystal silicon substrates, the effective activation energy was 5.6 ± 0.3 and 5.7 ± 0.08 eV, respectively, for the C49 to C54 phase transformation carried out in the temperature range 600 to 700°C. We concluded that the transformation process occurred by nucleation and growth of the orthorhombic face-centered (C54) phase from the as-formed orthorhombic base-centered (C49) phase. The Avrami exponent of 2.2 ± 0.09 and the optical observations suggest that most of the nucleation occurred during the beginning of the transformation process. © 1994, The Electrochemical Society, Inc. All rights reserved.
Joy Y. Cheng, Daniel P. Sanders, et al.
SPIE Advanced Lithography 2008
T.N. Morgan
Semiconductor Science and Technology
A. Gangulee, F.M. D'Heurle
Thin Solid Films
Min Yang, Jeremy Schaub, et al.
Technical Digest-International Electron Devices Meeting