Conference paper
Processing and characterization of ultra-small silicon devices
G.A. Sai-Halasz
ESSDERC 1987
We report on an annealing process which controls the stress in SOS. By laser power inputs of various durations, we regrow the Si on a compressed sapphire surface. The room temperature stress in Si correlates with the time scale of the annealing process. The effect can be understood in terms of thermal stress at the sapphire surface.
G.A. Sai-Halasz
ESSDERC 1987
H.C. Card, F. Fang
Journal of Applied Physics
T.O. Sedgwick, M. Berkenblit, et al.
Applied Physics Letters
F. Fang, P.J. Stiles
Physical Review B