Simulation of metal atom clustering at a metal-polymer interface

Abstract

The utilization of polyimides as encapsulants for microelectronic devices has focussed interest upon the metal-polyimide interface. The present paper examines Monte Carlo results involving the clustering at the copper-polyimide interface. Statistics associated with the distribution of clusters are presented and a visual picture of the coverage that is expected for the deposition of a single monolayer of copper is given. The present simulation attempts to provide a picture of interface formation between a metal and polymer for the particular case when the metal binds relatively weakly to the polymer, e.g., copper on a polyimide. It is shown that one should expect not only significant penetration of the metal into the polymer, but also significant metal atom clustering at the metal-polymer interface. This is consistent with what is being observed.