Conference paperCoupling analysis of through-silicon via (TSV) arrays in silicon interposers for 3D systemsBiancun Xie, Madhavan Swaminathan, et al.EMC 2011
PaperDirected assembly of lamellae-forming block copolymers by using chemically and topographically patterned substratesSang-Min Park, Mark P. Stoykovich, et al.Advanced Materials
Conference paperCharacterization of thin dielectric films as copper diffusion barriers using triangular voltage sweepS. Cohen, J.C. Liu, et al.MRS Spring Meeting 1999
