About cookies on this site Our websites require some cookies to function properly (required). In addition, other cookies may be used with your consent to analyze site usage, improve the user experience and for advertising. For more information, please review your options. By visiting our website, you agree to our processing of information as described in IBM’sprivacy statement. To provide a smooth navigation, your cookie preferences will be shared across the IBM web domains listed here.
Publication
IEDM 2016
Conference paper
Reliability study of a 128Mb phase change memory chip implemented with doped Ga-Sb-Ge with extraordinary thermal stability
Abstract
Doped Ga-Sb-Ge showed good thermal stability and fast switching speed. In this work, we present the results of a comprehensive reliability study for the relationship between cycling endurance and thermal stability on a 128Mb chip using modified doped Ga-Sb-Ge material. The chip exhibited good cycling endurance > 100K cycles, and there was no fail bits after soldering test. Furthermore, the chip showed no issue for 100K cycles after 260°C baking for 1000 seconds. In terms of the data retention, it was estimated that the PCM could retain data for 10 years at 215°C after 1K pre-cycles, 210°C after 10K pre-cycles, and 205°C after 100K pre-cycles. The PCM is suitable for applications requiring high thermal stability and cycling endurance.