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DFT 2004
Conference paper

Reliability and yield: A joint defect-oriented approach

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Abstract

We present a model for computing the probability of a parametric failure due to a spot defect. The analysis is based on electromigration in conductors under unidirectional current stress. Analytical solution is given for simple layout and simulations for a more complicated case. Then we show that in some cases electromigration-dependent parametric defects can make a significant contribution to the total yield estimation. © 2004 IEEE.

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Publication

DFT 2004

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