D. Edelstein, H.S. Rathore, et al.
IRPS 2004
Paper
Relationship between interfacial adhesion and electromigration in Cu metallization
Abstract
The relationship between interfacial adhesion and electromigration in Cu metallization was discussed. The electromigration drift velocity and lifetime in a conventional electromigration was also derived. The results indicated a linear relationship between the electromigration activation energy and the intrinsic work of adhesion.
Related
Workshop paper
Electromigration challenges for nanoscale Cu wiring
C.-K. Hu, L. Gignac, et al.
International Workshop on Stress-Induced Phenomena in Metallization 2008
S.L. Wright, R.J. Polastre, et al.
ECTC 2006
J.R. Lloyd, E. Liniger, et al.
Microelectronics Reliability