Conference paperCoupling analysis of through-silicon via (TSV) arrays in silicon interposers for 3D systemsBiancun Xie, Madhavan Swaminathan, et al.EMC 2011
PaperCharacterization of large magnetic anisotropies in (100)- and (111)-oriented Co/Pt multilayers by Brillouin light scatteringJ.V. Harzer, B. Hillebrands, et al.Journal of Magnetism and Magnetic Materials
PaperSuperconductivity of lanthanum intermetallic compounds with the Cu3Au structureR.J. Gambino, N.R. Stemple, et al.Journal of Physics and Chemistry of Solids
