Conference paper
A dynamic body discharge technique for SOI circuit applications
J.B. Kuang, M.J. Saccamango, et al.
IEEE International SOI Conference 1999
A detailed study on the scaling property trench isolation capacitance for advanced high-performance bipolar applications is presented. It is shown that the trench isolation capacitance depends on the trench structure, particularly the trench bottom and the trench fill. The dependence of the trench isolation capacitance on the trench width is then analyzed for various commonly used trench structures. The impact on the scaled-down high-performance ECL circuits is presented. © 1990 IEEE
J.B. Kuang, M.J. Saccamango, et al.
IEEE International SOI Conference 1999
C.T. Chuang, D.D. Tang
IEEE Journal of Solid-State Circuits
P.F. Lu, J. Ji, et al.
LPED 1996
P.F. Lu, J. Ji, et al.
LPED 1996