Xinyi Su, Guangyu He, et al.
Dianli Xitong Zidonghua/Automation of Electric Power Systems
Microscale Laser Shock Peening (LSP) is a technique that can be potentially applied to manipulate the residual stress distributions in metal film structures and thus improve the reliability of micro-devices. This paper reports high-spatial-resolution characterization of shock treated copper thin films on single-crystal silicon substrates, where scanning x-ray microtopography is used to map the relative variation of the stress/strain field with micron spatial resolution, and instrumented nanoindentation is applied to measure the distribution of hardness and deduce the sign of the stress/strain field. The measurement results are also compared with 3-D simulation results. The general trends in simulations agree with those from experimental measurements. Simulations and experiments show that there is a near linear correlation between strain energy density at the film-substrate interface and the X-ray diffraction intensity contrast.
Xinyi Su, Guangyu He, et al.
Dianli Xitong Zidonghua/Automation of Electric Power Systems
Yigal Hoffner, Simon Field, et al.
EDOC 2004
J.P. Locquet, J. Perret, et al.
SPIE Optical Science, Engineering, and Instrumentation 1998
Donald Samuels, Ian Stobert
SPIE Photomask Technology + EUV Lithography 2007