A high speed magneto-optic camera system
Mark H. Kryder, A. Deutsch
Proceedings of SPIE 1989
A major-minor loop chip design is presented which requires one high resolution masking step and no critical mask alignments. This design may therefore be implemented with electron- beam, X-ray, or deep-UV conformable-contact lithography to define the submicron linewidths required in ultra-high density devices. Chips with 20-μm period were fabricated with a layered Au-first, NiFe-second structure in a design which provided 6 percent overall margins; substitution of an improved merge component would allow a 10 percent margin overlap of all functions. Tests of components with 8μm periods show margins of similar percentage values. Current requirements for the devices are low (10 mA for 8 μm period) so that the designs appear extendable to much higher densities. Copyright © 1978 by The Institute of Electrical and Flectronics Engineers, Inc.
Mark H. Kryder, A. Deutsch
Proceedings of SPIE 1989
Ian L. Sanders, Mark H. Kryder
Journal of Applied Physics
Mark H. Kryder, Kie Y. Ahn, et al.
IEEE Transactions on Magnetics
Mitchell S. Cohen, George S. Almasi, et al.
IEEE Transactions on Magnetics