About cookies on this site Our websites require some cookies to function properly (required). In addition, other cookies may be used with your consent to analyze site usage, improve the user experience and for advertising. For more information, please review your options. By visiting our website, you agree to our processing of information as described in IBM’sprivacy statement. To provide a smooth navigation, your cookie preferences will be shared across the IBM web domains listed here.
Publication
ECTC 2024
Conference paper
Laser Attach Process Development and material selection
Abstract
Wafer-scale laser attach process development, that includes optical encapsulant material selection for efficient and reliable laser to silicon photonic coupling are presented here. A hybrid flip-chip 3D heterogenous integration of III-V laser component into Silicon Photonics chip cavity using laser-assisted Bonding technic is used. Power up to 16 dBm injected in the PIC waveguide was achieved using high precision alignment strategies; and advanced early reliability assessment tests of the encapsulant materials were performed to screen various candidates and demonstrate effective mechanical joint protection as well as electrical and optical performance stability over the stresses test. A median optical degradation delta of less than 0.4dB after the stresses have been recorded which is within the measurement error of the test setup.