Shaoning Yao, Wei-Tsu Tseng, et al.
ADMETA 2011
Solder joints were prepared from seven eutectic and near-eutectic Sn-based compositions and characterized for electrical resistivity after 100 h and 1,000 h of isothermal aging at 423 K. The solder joint samples were prepared by hand soldering to copper substrates, and the post-heat treatment resistivity was measured at room temperature in a specially designed, four-point probe fixture. Compositions tested included Sn-3.5Ag, Sn-3.7Ag-0.9Cu, Sn-3.0Ag0.5Cu, Sn-3.6Ag-1.0Cu, and Sn-3.9Ag-0.6Cu. In addition, the effect of a minor addition of a fourth element, designed to improve high-temperature shear strength, was also evaluated in the compositions Sn-3.7Ag-0.6Cu-0.3Co and Sn-3.7Ag-0.7Cu-0.2Fe. The observed changes in electrical resistivity are discussed in terms of microstructural coarsening, diffusional transport from the substrate, and nucleation of precipitate phases.
Shaoning Yao, Wei-Tsu Tseng, et al.
ADMETA 2011
U. Wieser, U. Kunze, et al.
Physica E: Low-Dimensional Systems and Nanostructures
A. Krol, C.J. Sher, et al.
Surface Science
I. Morgenstern, K.A. Müller, et al.
Physica B: Physics of Condensed Matter