E. Babich, J. Paraszczak, et al.
Microelectronic Engineering
The temperature dependence of the yield stress of pure lead and lead containing 3000 ppm of tin was measured using amplitude-dependent internal-friction measurements. The results are used to distinguish between models for the effect. It is shown that the temperature dependence of the stress drop is not consistent with existing rate theories, but is as expected from the inertial model. However, the low-temperature dependence of the yield stress is characteristic of a thermally-activated rate process and indicates that a mechanism combining thermal activation and inertial effects is required. It is concluded that the effect is initiated by the thermal overcoming of obstacles by dislocations, followed by inertial overcoming of subsequent obstacles. © 1978 The American Physical Society.
E. Babich, J. Paraszczak, et al.
Microelectronic Engineering
Ranulfo Allen, John Baglin, et al.
J. Photopolym. Sci. Tech.
A. Nagarajan, S. Mukherjee, et al.
Journal of Applied Mechanics, Transactions ASME
Michael Ray, Yves C. Martin
Proceedings of SPIE - The International Society for Optical Engineering