Silicon photonics and challenges for fabrication
N. Feilchenfeld, Karen Nummy, et al.
SPIE Advanced Lithography 2017
Improving the scalability and cost efficiency of photonic packaging is central to fulfilling the silicon photonic promise of low-cost devices with unprecedented optical complexity. A key enabler toward this goal is an efficient, large-mode, integrated fiber coupler and mode converter. Using standard fiber modes at fiber-to-chip junctions avoids expensive in-fiber mode conversion and relaxes alignment tolerances for low-cost assembly and improved reliability. Metamaterial waveguides, also called subwavelength gratings, are particularly useful for such structures. They provide unmatched design flexibility and, counter-intuitively, are more forgiving to fabrication tolerances than solid-core waveguides. Here, we summarize our work on interfacing self-aligned, standard cleaved fibers to rectangular Si routing waveguides. Fiber V-grooves are integrated on chip with metamaterial converters embedded in suspended oxide membranes to prevent coupler-mode leakage to the substrate. We show optical results from first integration of V-grooves with metamaterial converters to commercial structures fabricated in 300 mm CMOS production facilities. We demonstrate a peak transmission of -0.7 dB on the TE polarization and -1.4 dB on the TM polarization with a respective spectral roll-off of 0.3 and 0.4 dB over the 60 nm bandwidth measured.
N. Feilchenfeld, Karen Nummy, et al.
SPIE Advanced Lithography 2017
Tymon Barwicz, Charles W. Holzwarth, et al.
CLEO 2007
Joyce K. S. Poon, Wesley D. Sacher, et al.
CLEO 2014
Tymon Barwicz, Ted W. Lichoulas, et al.
OFC 2017