Conference paperCoupling analysis of through-silicon via (TSV) arrays in silicon interposers for 3D systemsBiancun Xie, Madhavan Swaminathan, et al.EMC 2011
Conference paperGrowth and transport properties of multilayer superconducting films of Nd1.83Ce0.17CuOx / YBa2Cu3O7-δA. Gupta, R. Gross, et al.SPIE Advances in Semiconductors and Superconductors 1990
PaperSchottky contacts to cleaved GaAs (110) surfaces. I. Electrical properties and microscopic theoriesA.B. McLean, R.H. WilliamsJournal of Physics C: Solid State Physics
PaperOn the Crystal Structure of Azafullerene (C59N)2C.M. Brown, L. Cristofolini, et al.Chemistry of Materials