Paper

01 Jan 1981

I-2 Shallow Silicide Contact for Shallow Junction Devices

View publication

Abstract

No abstract available.

Related

Paper

Thermal stability and electrical conduction behavior of coevaporated WSi_2±x thin films

Paper

Stress and phase changes in a low-thermal-expansion Al-3at.%Ge alloy film on oxidized silicon wafers

Paper

Interdiffusion in copper-aluminum thin film bilayers. I. Structure and kinetics of sequential compound formation

Paper

Solute effect of Cu on interdiffusion in Al3Ti compound films

View all publications