S.R. Herd, K.Y. Ahn, et al.
Journal of Applied Physics
The laser-jet electroplating technique has been applied to the high-speed deposition of copper at rates up to 50 μm/s. The high plating efficiency of the Cu/Cu++ system makes the deposition rate independent of laser power (unlike that of gold). On the other hand, the morphology of the copper is greatly improved with increasing laser power. Four-point probe measurements for laser-jet copper depositions indicate a resistivity close to that of the published bulk value.
S.R. Herd, K.Y. Ahn, et al.
Journal of Applied Physics
R.J. Von Gutfeld, B. Welber, et al.
IEEE JQE
R.J. Von Gutfeld, M.H. Gelchinski, et al.
Proceedings of SPIE 1989
M.H. Gelchinski, L. Romankiw, et al.
JES