Publication
ICEPT-HDP 2008
Conference paper

High density 3D integration

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Abstract

This paper discusses the current and future needs in continued CMOS scaling, reviews the status of the transfer and joining (TJ) technology for MCM-D and wafer level 3DI integration, and explores the opportunities of the TJ technology in the realm of the "More than Moore" era. © 2008 IEEE.

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Publication

ICEPT-HDP 2008

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