Alina Deutsch, Roger S. Krabbenhoft, et al.
IEEE Trans Electromagn Compat
An extensive study of crosstalk simulation issues for on-chip interconnections was performed for representative six-layer Al(Cu) structures. Guidelines are given for the range of conditions when R(f)L(f)C versus RLC versus RC circuit representations are valid. Examples are also given of realistic short and long coupled-section interactions and the effect of in-plane neighboring connections is discussed. A frequency-dependent crosstalk simulation technique is shown. All simulation results are verified through measurement of a comprehensive set of experiments built with a large range of line widths and spaces on various layers with both in-plane and vertical coupling. Signal propagation and crosstalk are analyzed over the temperature range -160 °C to +100 °C and interconnect bandwidth limitations predictions are given.
Alina Deutsch, Roger S. Krabbenhoft, et al.
IEEE Trans Electromagn Compat
Alina Deutsch, Christopher W. Surovic, et al.
IEEE Transactions on Components Packaging and Manufacturing Technology Part B
Yulei Zhang, Ling Zhang, et al.
EPEPS 2008
Haikun Zhu, Rui Shi, et al.
IEEE Topical Meeting EPEPS 2006