PaperDevelopment of conductive adhesive materials for via fill applicationsSung K. Kang, Stephen L. Buchwalter, et al.Proceedings - Electronic Components and Technology Conference
PaperEffects of mechanical stress and moisture on packaging interfacesStephen L. Buchwalter, Peter J. Brofman, et al.IBM J. Res. Dev
PaperOrganic Chemistry on a Polyimide SurfaceRichard R. Thomas, Stephen L. Buchwalter, et al.Macromolecules
Conference paperBuilding a packaging hierarchy for optical interconnects using polymer waveguides: Exploring the optionsStephen L. Buchwalter, Russell Budd, et al.GBC 2006
