Fabrication of a silicon-Pyrex-silicon stack by a.C. Anodic bonding

Abstract

This paper reports a new mounting technique for bonding silicon-Pyrex-silicon stacks based on anodic bonding and alternating current (a.c.) excitation. The bond is mechanically stable and strong enough to withstand a shear force of at least 1 MPa, or further reactive ion and wet chemical etching processes. The technique has been optimized to be independent of various modifications of the stack dimensions or bonding parameters (e.g., temperature, voltage, quality of the contact).