C. Wang, S.W. Nam, et al.
IEDM 2013
A first time rigorous experimental study of effective current (I eff) variability in high-volume manufacturable (HVM) 14nm Silicon-On-Insulator (SOI) FINFETs is reported which identifies, threshold voltage (Vtlin), external resistance (Rext), and channel trans-conductance (Gm) as three independent sources of variation. The variability in Gm, Vtlin (A VT=1.4(n)/0.7(p) mV-μm), and Ieff exhibit a linear Pelgrom fit indicating local variations, along with non-zero intercept which suggests the presence of global variations at the wafer level. Relative contribution of Gm to Ieff variability is dominant in FINFETs with small number of fins (Nfin); however, both Gm and Rext variations dominate in large Nfin devices. Relative contribution of Vtlin remains almost independent of Nfin. Both n and p FINFETs show the above mentioned trends. © 2013 IEEE.
C. Wang, S.W. Nam, et al.
IEDM 2013
Kafai Lai, Alan E. Rosenbluth, et al.
SPIE Advanced Lithography 2007
John G. Long, Peter C. Searson, et al.
JES
E. Burstein
Ferroelectrics