About cookies on this site Our websites require some cookies to function properly (required). In addition, other cookies may be used with your consent to analyze site usage, improve the user experience and for advertising. For more information, please review your options. By visiting our website, you agree to our processing of information as described in IBM’sprivacy statement. To provide a smooth navigation, your cookie preferences will be shared across the IBM web domains listed here.
Publication
Microlithography 2004
Conference paper
Combinatorial resist processing studies
Abstract
A new processing tool, the Thermal Gradient Plate (TGP) is described. The TGP allows for a range of temperatures to be expressed on a wafer or other substrate in a controlled and reproducible manner. Materials coated on a substrate can be baked across a range of temperatures, allowing multiple experiments to be run in parallel. Combining orthogonal TGP bakes creates a matrix of temperature pairs on a single wafer, allowing two bake step processes to be studied in a single experimental run. Experimental results demonstrating a variety of resist studies are described, including resist CD temperature dependence, underlayer cure temperature determination, and two bake step interactions.