Co-Design of 300 mm Wafer Scale Package

Abstract

A novel packaging configuration was developed for a 300 mm wafer scale system. A number of these systems have been operated at power levels up to about 16 kW for over a year using a thermal test wafer. The power subsystem can provide a total of 22.5 kA of current for the 0.8 V and 1.2 V power domains to the wafer, and the I/O subsystem can provide an aggregate system bidirectional bandwidth of 128 GByte/s using PCIe Gen3 optical links, and a local HBM bandwidth through the laminate of 512 GByte/s per reticle site and 37.9 TByte/s per wafer. The system is nearly all water cooled.