About cookies on this site Our websites require some cookies to function properly (required). In addition, other cookies may be used with your consent to analyze site usage, improve the user experience and for advertising. For more information, please review your options. By visiting our website, you agree to our processing of information as described in IBM’sprivacy statement. To provide a smooth navigation, your cookie preferences will be shared across the IBM web domains listed here.
Publication
ITherm 2024
Conference paper
Co-Design of 300 mm Wafer Scale Package
Abstract
A novel packaging configuration was developed for a 300 mm wafer scale system. A number of these systems have been operated at power levels up to about 16 kW for over a year using a thermal test wafer. The power subsystem can provide a total of 22.5 kA of current for the 0.8 V and 1.2 V power domains to the wafer, and the I/O subsystem can provide an aggregate system bidirectional bandwidth of 128 GByte/s using PCIe Gen3 optical links, and a local HBM bandwidth through the laminate of 512 GByte/s per reticle site and 37.9 TByte/s per wafer. The system is nearly all water cooled.