Conference paperCharacterization of thin dielectric films as copper diffusion barriers using triangular voltage sweepS. Cohen, J.C. Liu, et al.MRS Spring Meeting 1999
PaperElectromigration in AlCu lines: Comparison of Dual Damascene and metal reactive ion etchingR. Filippi, M. Gribelyuk, et al.Thin Solid Films
Conference paperIn situ TEM analysis of TiSi2 C49-C54 transformations during annealingL. Gignac, V. Svilan, et al.MRS Fall Meeting 1996