Min Yang, Jeremy Schaub, et al.
Technical Digest-International Electron Devices Meeting
The amorphous to face-centered cubic (fcc) and fcc to hexagonal close-packed (hcp) crystallization temperatures of GeSbTe thin films on underlying silicon nitride and silicon dioxide films were studied through slow (1 K/min) resistance versus temperature measurements. The amorphous to fcc phase transition is observed at ∼ 170 C for both cases but the fcc to hcp phase transition temperature for GeSbTe films on silicon nitride is observed to be ∼ 80 C lower than for GeSbTe films on silicon dioxide, possibly due to the hexagonal symmetry of silicon nitride. © 2013 Elsevier B.V. All Rights Reserved.
Min Yang, Jeremy Schaub, et al.
Technical Digest-International Electron Devices Meeting
Kigook Song, Robert D. Miller, et al.
Macromolecules
R. Ghez, M.B. Small
JES
William Hinsberg, Joy Cheng, et al.
SPIE Advanced Lithography 2010