Applications of rheology in the computer industry

Abstract

Liquid crystal polymers were studied for circuit board applications. Solder paste rheology was found to be a useful measure of solder paste performance. In the area of hot melt adhesives, rheological tests were employed in specifying a blend with improved melt flow properties and solubility. Time-temperature superposition was employed to predict lifetime from accelerated life test data. The characteristic time of disk lubricants was measured to help explain the results of tribological testing. Overall, rheology plays a key role in the development of new materials for the computer industry.