Conference paper3D Die-Stack on Substrate (3D-DSS) Packaging Technology and FEM Analysis for 55um-75um Mixed Pitch Interconnections on High Density Laminate Katsuyuki Sakuma, Mukta Farooq, et al.ECTC 2021
Conference paperSolving optimization tasks power-efficiently exploiting VO2's phase-change properties with Oscillating Neural NetworksOlivier Maher, N. Harnack, et al.DRC 2023
PaperA 7-nm Four-Core Mixed-Precision AI Chip with 26.2-TFLOPS Hybrid-FP8 Training, 104.9-TOPS INT4 Inference, and Workload-Aware ThrottlingSae Kyu Lee, Ankur Agrawal, et al.IEEE JSSC
Conference paperReliable Chiplet Integration on High Density Laminate (2.X D) for AI HardwareDivya Taneja, Jonathan Grenier, et al.ECTC 2024
