A study on crosstalk analysis in aggregative transmission lines with turning vias

Abstract

This paper presents measurement, modeling and simulation studies of high-speed signal propagation in multilayered PCB with turning vias (immediate layer changing) in a mixed-referencing environment. The effects of turning vias, plane referencing, decoupling capacitor placement and, panel dimensions on high-speed signal propagation in an organic board are studied. © 2009 IEEE.