Bio
Atom O. Watanabe is a Research Scientist who currently works at the IBM T. J. Watson Research Center as an IC packaging architect for advanced packaging and heterogeneous chiplet integrations. His current research interests and expertise include modeling and design, signal/power integrity analysis, and hardware characterization for millimeter-wave packages, co-packaged optics, high-performance computations, and quantum computers.
Dr. Watanabe's contributions to the field include over 40 publications in renowned journals such as Applied Physics Letters, IEEE Transactions on Components, Packaging, and Manufacturing Technology, IEEE Transactions on Microwave Theory and Techniques, and IEEE Transactions Electromagnetic Compatibility, as well as numerous presentations at top-tier conferences like the Electronic Components and Technology Conference (ECTC) and Chiplet Summit. Furthermore, Dr. Watanabe has received multiple paper awards in recognition of his work. He has been serving on technical program committees for IEEE Microwave Theory and Technology Society and Chiplet Summit. He obtained a PhD in electrical and computer engineering from the Georgia Institute of Technology.
Email: atom[at]ibm.com
Publications
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