Publications

3 results at IMAPS 2012

Effect of preformed IMC layer on electromigration of solder capped cu pillar bump interconnection on an organic substrate
- - Yasumitsu Orii
  - Kazushige Toriyama
  - et al.
- 2012
- IMAPS 2012
Assessment of XRF technique as a method to measure percent ag in SnAg solders for flip chip applications
- - Jennifer D. Schuler
  - Chia-Hsin Shih
  - et al.
- 2012
- IMAPS 2012
Formulation of percolating thermal underfills using hierarchical self-assembly of micro- and nanoparticles by centrifugal forces and capillary bridging
- - Thomas Brunschwiler
  - Gerd Schlottig
  - et al.
- 2012
- IMAPS 2012